Card Lamination Cushion Pad MLP Series
The structure of cushion pads is silicon rubber layer in the middle plus heatproof felt layers on the surface.
It is heatproof with great durability, which can well meet the technological requirements in plastic card lamination.
It can transfer heat quickly and evenly, which can improve production efficiency and energy conservation.
It has good cushioning performance to avoid the damage and scratching resulting from direct contacting between template and lamination steel plates, which can extend the service life of both lamination steel plates and template.
|
Model |
MLP-1 |
MLP-2 |
MLP-3 |
|
Surface material |
Silicon rubber with patterns |
Heat-proof felt |
Copper wire plus silicon rubber |
|
Middle material |
Glass fiber |
Silicon rubber |
Copper wire |
|
Thickness |
|
|
2～ |
|
Thickness tolerance |
± |
± |
± |
|
Elastic resilience |
Excellent |
Good |
Good |
|
Color |
White |
White |
Brown |
|
Hardness |
55±5 |
50±5 |
65 |
|
Layer adhesion strength |
≥ 10 N/cm |
≥ 10 N/cm |
|
|
Application temperature |
≤ |
≤ |
≤ |
|
Pressure level |
＜10 MPa |
＜10MPa |
15-35MPa |
|
Storage temperature |
0 |
0 |
0 |
|
Storage humidity |
＜40%RH |
＜40%RH |
＜40%RH |
|
Application scope |
Inlay sheet, normal card, SIM card, bank cards, etc. |
Inlay sheet, normal card, SIM card, bank cards, etc. |
Inlay sheet, ID card, bank cards, etc. |
- Next Product:Card Lamination Steel Plate MSP Series
